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Laser Depaneling of PCB
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Product: Views:366Laser Depaneling of PCB 
Unit price: Negotiable
Delivery date: Since the payment date Days delivery
Valid until: Long-term effective
Last updated: 2017-12-26 04:32

10W UV Optowave Laser PCB Separator for Non-contact Depaneling Method Features:

1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance

FPC / PCB Laser Depaneling Machine Technical Parameter:

Laser class


Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

*1520 mm


~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA


Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)


< 60 % (non-condensing)

Required accessoires

Exhaust unit

FPC/PCB/ Rigid-Flex PCB Cutting Machine Laser Depaneling Equipment Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:

1.Damages and fractures to substrates and circuits due to mechanical stress

2.Damages to PCB due to accumulated debris

3.Constant need for new bits, custom dies, and blades

4.Lack of versatility – each new application requires ordering of custom tools, blades, and dies

5.Not good for high precision, multi-dimensional or complicated cuts

6.Not useful PCB depaneling/singulation smaller boards

Q Switched Diode Pumped All Solid State UV Laser Depaneling Machine Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;

PCB Laser Separator Advantages:

1.Auto vision positioning

2.Cost saving – no consumables and die wear

3.Able to cut odd, complex and micro shape section out of PCBs

4.No mechanical stress on product

5.Quick model change turnaround time

6.Excellent cut finish

CE Approval:

Our Honor Clients:


The Visiting of Clients: